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Author:   Earl E. Swartzlander Jr. ,  Earl E Swartzlander Jr
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1989
Dimensions:   Width: 15.50cm , Height: 2.70cm , Length: 23.50cm
Weight:   0.801kg
ISBN:  

9781461288961

ISBN 10:   1461288967
Pages:   503
Publication Date:   09 February 2012
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
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Table of Contents

1. Promise and Pitfalls of WSI.- WSI and Common Sense.- Evaluation of the Promise.- References.- 2. Feasibility of Large Area Integrated Circuits.- Motivation for Easily Manufacturable Large Area ICs.- Feasibility of Large Area ICs.- Future Research.- Summary and Conclusions.- References.- 3. Architectural Yield Optimization.- WSI Background.- Fault Modeling.- Architectural Yield Modeling.- Optimizing Redundancy in a B-Tree Design.- Results and Conclusions.- References.- 4. Spare Allocation/Reconfiguration for WSI.- A Survey of Reconfiguration Algorithms.- Spare Allocation with Dedicated Spares.- Integrating Diagnosis and Spare Allocation in Large Memories.- Diagnosis and Repair of Large Programmable Logic Arrays.- Computer-Aided Design for Reconfiguration.- Conclusions.- Acknowledgments.- References.- 5. A WSI Image Processor.- Parallel Computer Vision Requirements.- WASP: A WSI Associative String Processor.- ASP Operational Principles.- ASP Software.- WASP Design Strategy.- ASP Development Program.- ASP Performance Forecasts.- Conclusions.- Acknowledgements.- References.- 6. The 3-D Computer: An Integrated Stack of WSI Wafers.- Three-Dimensional Integration.- Concept of a 3-D Computer.- Architecture of the 3-D Computer.- The Enabling 3-D Technologies.- WSI Circuits.- Description of 3-D Operation.- Summary.- Acknowledgments.- References.- 7. Laser Restructurable Technology and Design.- Methodology.- Laser Restructuring.- Design and Test.- Physical Design and Fabrication.- Applications.- Conclusions.- Acknowledgement.- References.- 8. High Yield In-Situ Fabrication of Multilevel Interconnections for WSI.- Wafer Scale Integration.- Wafer Scale Hybrid Packaging and Its Impact on WSI.- The Wafer Transmission Module.- Organic Insulators.- Whole Wafer Lithography Using Electron Beam Systems.- Planarized Processing.- Parylene and Parylene Derivatives for VDP.- Ionized Cluster Beam (ICB) and Partially Ionized Beam (PIB) Metal Deposition.- ICB of Organics.- Development of a Dry Lift-Off Process.- Single Wafer Processing.- Focused Ion Beam Testing and Repair.- Conclusions.- Acknowledgements.- References.- 9. Wafer-Scale Testing/Design for Testability.- The Problem of Wafer-scale Testing.- Steps in Testing and Configuring a Wafer-scale System.- A Short Review of Testing Methods.- Active Element Testing.- Switch Array Testing.- Conclusions.- Acknowledgement.- References.- 10. Wafer-Scale Multichip Packaging Technology.- Silicon Multichip Packaging.- Innovative Approaches to Chip Mounting and Interconnection.- Packaging the Silicon Wafer.- Summary.- References.

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