Thermal Testing of Integrated Circuits

Author:   J. Altet ,  Antonio Rubio
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2002
ISBN:  

9781441952875


Pages:   204
Publication Date:   21 September 2011
Format:   Paperback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Thermal Testing of Integrated Circuits


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Overview

"Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The use of ambivalent procedures to test the analogue and digital sections of such complex circuits without interfering in their nominal operation is clearly a critical part of today's technological ipdustries. Chapter 1 presents the general purposes and basic concepts rel~ted With' the""testing of integrated circuits, discussing the various strategies and their limitations. Readers who are already familiar with the field may opt to skip this chapter. This book offers a multidisciplinary focus on thermal testing. This is a testing method which is not only suitable for use in combination with other existing techniques, but is also backed by a wealth of knowledge and offers exciting opportunities in the form of as yet unexplored areas of research and innovation for industrial applications."

Full Product Details

Author:   J. Altet ,  Antonio Rubio
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2002
Dimensions:   Width: 15.50cm , Height: 1.20cm , Length: 23.50cm
Weight:   0.349kg
ISBN:  

9781441952875


ISBN 10:   144195287
Pages:   204
Publication Date:   21 September 2011
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

1. Introduction to the Testing of Integrated Circuits.- 2. Thermal Transfer and Thermal Coupling in IC’s.- 3. Thermal Analysis in Integrated Circuits.- 4. Temperature as a Test Observable Variable in ICS.- 5. Thermal Monitoring of IC’s.- 6. Feasibility Analysis and Conclusions.

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