Overview

In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research­ ers using the book are encouraged to formulate programs that will establish scien­ tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.

Full Product Details

Author:   Michael Hosking ,  Frederick G. Yost
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1993
Dimensions:   Width: 15.20cm , Height: 1.90cm , Length: 22.90cm
Weight:   0.555kg
ISBN:  

9781468414424

ISBN 10:   1468414429
Pages:   250
Publication Date:   08 March 2012
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

1. Introduction: The Mechanics of Solder Alloy Wetting and Spreading.- 1.1 Soldering in Electronics.- 1.2 The Wetting Problem.- References.- 2. Solderability Testing.- 2.1 Introduction.- 2.2 The “Numbers” Problem.- 2.3 The Consistency Problem.- 2.4 The Requirements Problem.- 2.5 The Aging Problem.- 2.6 Conclusions.- 2.7 Appendix.- References.- 3. Fluxes and Flux Action.- 3.1 Introduction.- 3.2 Flux History.- 3.3 Flux Requirements.- 3.4 Rosin-Based Fluxes.- 3.5 Gaseous Fluxes.- 3.6 Inorganic Fluxes.- 3.7 Effect of Solder Impurities on Solderability.- 3.8 Solderability Tests.- References.- 4. Reactive Wetting and Intermetallic Formation.- 4.1 Introduction.- 4.2 Analysis of Solder Spreading Kinetics.- 4.3 Contact Line Motion Over Obstacles.- 4.4 Metallurgy of the Moving Contact Line.- 4.5 Thermodynamic Calculation of the Ternary Pb-Sn-Cu System.- 4.6 Wetting Balance Studies on Cu6sn5 and Cu3Sn.- 4.7 Conclusion.- 4.8 Acknowledgments.- References.- 5. Loss of Solderability and Dewetting.- 5.1 Introduction.- 5.2 Characterization of Dewetting.- 5.3 Wetting Stability Diagrams.- 5.4 Dynamics of Wetting Instabilities: Physical Mechanisms.- 5.5 Intermetallic Formation.- 5.6 Conclusions.- 5.7 Acknowledgments.- References.- 6. Oxidation of Solder Coatings.- 6.1 Introduction.- 6.2 Tin-Lead-Copper System Metallurgy.- 6.3 Role of Oxides in Solderability Loss.- 6.4 Tin-Lead Oxidation.- 6.5 Solderability Assessment Via Oxides.- 6.6 Accelerated Aging.- 6.7 Future Directions.- References.- 7. Surface and Interface Energy Measurements.- 7.1 Abstract.- 7.2 Introduction.- 7.3 Basic Concepts.- 7.4 Equilibrium Conditions for a Curved Interface.- 7.5 Capillarity Effect in Solids.- 7.6 Experimental Techniques.- 7.7 Conclusions.- 7.8 Acknowledgments.- References.- 8. Advanced SolderingProcesses.- 8.1 Impetus for Change.- 8.2 Alternative Approaches to Promote Wetting.- 8.3 Alternate Heat Sources.- 8.4 Solder Bump Technology.- 8.5 Future Directions for Solder Process Technology.- 8.6 Acknowledgments.- References.- 9.0 Reliability-Related Solder Joint Inspection.- 9.1 Abstract.- 9.2 Motivation.- 9.3 Inspection Criteria.- 9.4 Inspection Technologies.- 9.5 Mantech/ADSP Solder Joint Inspection Example.- 9.6 Inspection Automation.- 9.7 Advanced Solder Joint Inspection Techniques.- 9.8 Conclusions.- References.- 10. The Properties of Composite Solders.- 10.1 Introduction.- 10.2 Mechanics of Solder Joints.- 10.3 Alloy Design for Thermomechanical Fatigue Resistance.- 10.4 Methods of Producing Composite Solder Alloys.- 10.5 In-Situ Composite Solders by Rapid Solidification.- 10.6 Properties of Composite Solder Alloys.- 10.7 Summary.- References.

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