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OverviewThe performance of computer chips has been improved by reducing the size of all components. With this continuing trend towards miniaturization in microelectronic devices, mechanical stresses have become a major reliability concern for the so-called back-end metallization, i.e., the wiring of a microchip made of Al and Cu alloy thin films. The mechanical stresses originate from film deposition, thermal mismatch or electromigration and may cause damage and ultimate failure of devices. This workshop provided a forum for in-depth discussions of fundamental aspects, such as thin film plasticity, as well as reliability issues related to these stress-induced phenomena. Full Product DetailsAuthor: Oliver Kraft , Eduard Arzt , Cynthia A. Volkert , P. S. HoPublisher: American Institute of Physics Imprint: American Institute of Physics Volume: v.491 Dimensions: Width: 17.10cm , Height: 2.30cm , Length: 23.00cm Weight: 0.667kg ISBN: 9781563969041ISBN 10: 1563969041 Pages: 325 Publication Date: 29 October 1999 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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