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OverviewAddresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry. Full Product DetailsAuthor: Michael Pecht (University of Maryland, College Park)Publisher: John Wiley & Sons Inc Imprint: Wiley-Interscience Dimensions: Width: 15.80cm , Height: 2.30cm , Length: 22.10cm Weight: 0.549kg ISBN: 9780471591672ISBN 10: 047159167 Pages: 312 Publication Date: 06 July 1993 Audience: Professional and scholarly , General/trade , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationMichael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering. Tab Content 6Author Website:Countries AvailableAll regions |
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