Overview

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Full Product Details

Author:   King-Ning Tu
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2007
Volume:   92
Dimensions:   Width: 15.50cm , Height: 2.00cm , Length: 23.50cm
Weight:   0.593kg
ISBN:  

9781441922847

ISBN 10:   1441922849
Pages:   370
Publication Date:   19 November 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of print, replaced by POD  
We will order this item for you from a manufatured on demand supplier.

Table of Contents

Copper—Tin Reactions.- Copper–Tin Reactions in Bulk Samples.- Copper–Tin Reactions in Thin-Film Samples.- Copper–Tin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration.- Thermomigration.

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