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OverviewThe history of the application of semiconductors for controlling currents goes back all the way to 1926, in which Julius Lilienfeld led a patent for a “Method and apparatus for controlling electric currents” [1], which is considered the rst work on metal/semiconductor eld-effect transistors. More well-known is the work of William Shockley, John Bardeen and Walter Brattain in the 1940s [2, 3], after which the development of semiconductor devices commenced. In 1958, independent work from Jack Kilby and Robert Noyce ledto the invention of integrated circuits. A few milestones in IC design are the rst monolithic operational ampli er in 1963 (Fairchild?A702, Bob Widlar) and the rst o- chip 4-bit microprocessor in 1971 (Intel 4004). Ever since the start of the semiconductor history, integration plays an imp- tant role: starting from single devices, ICs with basic functions were developed (e. g. opamps, logic gates), followed by ICs that integrate larger parts of a s- tem (e. g. microprocessors, radio tuners, audio ampli ers). Following this trend of system integration, this eventually leads to the integration of analog and d- ital components in one chip, resulting in mixed-signal ICs: digital components are required because signal processing is preferably done in the digital - main; analog components are required because physical signals are analog by nature. Mixed-signal ICs are already widespread in many applications (e. g. - dio, video); for the future, it is expected that this trend will continue, leading to a larger scale of integration. Full Product DetailsAuthor: Pieter Harpe , Hans Hegt , Arthur H.M. van Roermund , Hans HegtPublisher: Springer Imprint: Springer Edition: 2010 ed. Dimensions: Width: 15.50cm , Height: 1.10cm , Length: 23.50cm Weight: 0.950kg ISBN: 9789048190416ISBN 10: 904819041 Pages: 167 Publication Date: 05 July 2010 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsList of symbols and abbreviations. 1. INTRODUCTION. 2. AD AND DA CONVERSION. 1 Introduction. 2 Trends in applications. 3 Trends in technology. 4 Trends in system design. 5 Performance criteria. 6 Conclusion. 3. SMART CONVERSION. 1 Introduction. 2 Smart concept. 3 Application of the smart concept. 4 Focus in this work. 5 Conclusion. 4. SMART DA CONVERSION. 1 Introduction. 2 Area of current-steering DACs. 3 Correction of mismatch errors. 4 Sub-binary variable-radix DAC. 5 Design example. 6 Conclusion. 5. DESIGN OF A SUB-BINARY VARIABLE-RADIX DAC. 1 Schematic design. 2 Layout. 3 Self-measurement-circuit implementation. 4 Experimental results. 5 Conclusion. 6. SMART AD CONVERSION. 1 Introduction. 2 Literature review. 3 High-speed high-resolution AD conversion. 4 Smart calibration. 5 Conclusion. 7. DESIGN OF AN OPEN-LOOP T&H CIRCUIT. 1 Literature review. 2 Design goal. 3 T&H architecture. 4 Sampling core architecture. 5 Output buffer architecture. 6 T&H design. 7 Experimental results. 8 Conclusion. 8. T&H CALIBRATION. 1 Introduction. 2 T&H accuracy. 3 T&H calibration method. 4 Analog correction parameters. 5 Digitally assisted analog correction. 6 Simulation results. 7 Implementation of the calibration method and layout. 8 Experimental results. 9 Conclusion. 9. T&H CALIBRATION FOR TIME-INTERLEAVED ADCS. 1 Introduction. 2 Channel matching in time-interleaved T&H’s. 3 Channel mismatch calibration. 4 Channel mismatch detection. 5 Channel mismatch correction. 6 Simulation results. 7 Implementation of the calibration method and layout. 8 Experimental results. 9 Conclusion. 10. CONCLUSIONS. References. Index.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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