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OverviewBondgraphs are a powerful tool in the simulation of mechanical, hydraulic, electric and thermal systems. They are used to represent engineering systems in written form by means of letter elements and their interconnections, called bonds, instead of in the form of numerous equations. They may be used to increase the efficiency of new product design. This book introduces the reader to bondgraphs and their use on PCs. A broad variety of applications of this method in the simulation of the above systems is presented. Twenty fully worked examples complement the presentation. Full Product DetailsAuthor: Jean U. ThomaPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: Softcover reprint of the original 1st ed. 1990 Dimensions: Width: 15.50cm , Height: 1.00cm , Length: 23.50cm Weight: 0.312kg ISBN: 9783642839245ISBN 10: 364283924 Pages: 188 Publication Date: 08 December 2011 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand ![]() We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |