Signal Integrity Characterization Techniques

Author:   Eric Bogatin ,  Mike Resso
Publisher:   International Engineering Consortium
ISBN:  

9781931695930


Pages:   375
Publication Date:   15 February 2009
Format:   Paperback
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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Signal Integrity Characterization Techniques


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Overview

Signal Integrity Characterization Techniques addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must be designed using today's most powerful analysis and characterization tools.Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements - from backplane for design challenges to error correction techniques to jitter measurement technologies. The authors' approach wisely addresses some of these new high-speed technologies, and it also provides valuable insight into its future direction and will teach the reader valuable lessons on the industry.

Full Product Details

Author:   Eric Bogatin ,  Mike Resso
Publisher:   International Engineering Consortium
Imprint:   International Engineering Consortium
Dimensions:   Width: 15.50cm , Height: 4.10cm , Length: 22.90cm
Weight:   1.043kg
ISBN:  

9781931695930


ISBN 10:   1931695938
Pages:   375
Publication Date:   15 February 2009
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Out of Print
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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