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OverviewFull Product DetailsAuthor: Andrea Chen , Randy Hsiao-Yu LoPublisher: Taylor & Francis Inc Imprint: CRC Press Inc Dimensions: Width: 15.60cm , Height: 1.80cm , Length: 23.40cm Weight: 0.453kg ISBN: 9781439862056ISBN 10: 1439862052 Pages: 216 Publication Date: 10 October 2011 Audience: College/higher education , General/trade , Tertiary & Higher Education , General Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsMeticulously written and organized ... this book has everything needed to develop a complete understanding of semiconductor packaging, particularly how materials interact with one another. ... this book is easy to read and, more importantly, easy to understand ... Particularly valuable are the appendices from the chapter describing analytical tools, what they are and how they are used and the chapter on destructive tools and tests. ... whether an experienced engineer involved in electronic packaging or a novice, you need to make sure that this volume is a part of your technical library. --Dan Beaulieu, D.B. Management Group, in I-Connect007, December 2011 This book provides a complete and systematic discussion of key materials used in electronic packages. Unlike most of its competitors which are composed by several contributors, this book is written by two authors who are well-respected veterans in the electronic package industry. Therefore, consistency and easy to follow for new engineers and students will be the most distinguishing features for this book. --Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA This book gives a good general overview of materials used in the making of semiconductor packages. The text covers both individual material types and their performance requirements in the end product. Also discussed are the historical background, purpose, key material properties, various material interactions, reliability requirements, and future trends. The book is easy to read and would serve as an excellent introduction to the subject for a student or engineer unfamiliar with the topic. It would also serve as a handy reference guide for a basic understanding of semiconductor packaging materials, as well of semiconductor packaging itself. --Zemo Yang, Ambarella Corp, Santa Clara, California, USA Materials technology is enabling the rapid development of new and advanced semiconductor packaging form factors. Knowledge of how material interactions impact package reliability and performance is ever more critical to the semiconductor industry, so both students and engineers need a resource to turn to in understanding material technology issues and trade-offs. This book serves as such a resource and reference guide to the world of semiconductor packaging materials. --Daniel P. Tracy, SEMI, San Jose, California, USA A great book for someone who quickly wishes to get up to speed in 1st level of semiconductor packaging. --Jack Belani, Vice President, Marketing and Sales, Contact Materials Division, Heraeus Materials Technology LLC This book provides a complete and systematic discussion of key materials used in electronic packages. Unlike most of its competitors which are composed by several contributors, this book is written by 2 authors who are well respected veterans in electronic package industry. Therefore consistency and easy to follow for new engineers and students will be the most distinguishing feature for this book. --Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA Author InformationAndrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations. Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents. Tab Content 6Author Website:Countries AvailableAll regions |
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