Overview

The text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations.

Full Product Details

Author:   Richard Brown
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2003
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   0.468kg
ISBN:  

9781441953131

ISBN 10:   1441953132
Pages:   284
Publication Date:   07 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Hybrids vs. Mimics.- Basic Concepts.- Planar Waveguides.- Current Flow and Loss Considerations.- Substrates.- Thick Film.- Thin Film.- Dielectric Deposition.- Polymers.- Processing Strategies.- Photolithigraphy.- Electroplating.- Etching.- Components.- Packaging.- Superconductivity.- Microelectromechnicalsystems-MEMS.

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