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OverviewThe text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations. Full Product DetailsAuthor: Richard BrownPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2003 ed. Dimensions: Width: 15.60cm , Height: 1.90cm , Length: 23.40cm Weight: 1.340kg ISBN: 9781402072338ISBN 10: 1402072333 Pages: 284 Publication Date: 31 December 2002 Audience: Professional and scholarly , General/trade , College/higher education , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsHybrids vs. Mimics.- Basic Concepts.- Planar Waveguides.- Current Flow and Loss Considerations.- Substrates.- Thick Film.- Thin Film.- Dielectric Deposition.- Polymers.- Processing Strategies.- Photolithigraphy.- Electroplating.- Etching.- Components.- Packaging.- Superconductivity.- Microelectromechnicalsystems-MEMS.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |