RF and Microwave Microelectronics Packaging
Author:   Ken Kuang ,  Franklin Kim ,  Sean S. Cahill
Publisher:   Springer-Verlag New York Inc.
Edition:   2010 ed.
ISBN:  

9781489983244


Pages:   285
Publication Date:   05 September 2014
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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RF and Microwave Microelectronics Packaging


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Overview

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Full Product Details

Author:   Ken Kuang ,  Franklin Kim ,  Sean S. Cahill
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2010 ed.
Dimensions:   Width: 15.50cm , Height: 1.60cm , Length: 23.50cm
Weight:   0.468kg
ISBN:  

9781489983244


ISBN 10:   1489983244
Pages:   285
Publication Date:   05 September 2014
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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