RF and Microwave Microelectronics Packaging
Author:   Ken Kuang ,  Franklin Kim ,  Sean S Cahill
Publisher:   Springer
ISBN:  

9781441909855


Pages:   304
Publication Date:   17 April 2010
Format:   Undefined
Availability:   Out of stock   Availability explained


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RF and Microwave Microelectronics Packaging


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Overview

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Full Product Details

Author:   Ken Kuang ,  Franklin Kim ,  Sean S Cahill
Publisher:   Springer
Imprint:   Springer
Dimensions:   Width: 23.40cm , Height: 1.60cm , Length: 15.60cm
Weight:   0.426kg
ISBN:  

9781441909855


ISBN 10:   1441909850
Pages:   304
Publication Date:   17 April 2010
Audience:   General/trade ,  General
Format:   Undefined
Publisher's Status:   Unknown
Availability:   Out of stock   Availability explained

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