Overview

Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Advances in Residual Stress Measurement Methods Residual Stress Effects on Material Performance Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement Thermomechanics & Infrared Imaging Inverse Methods Inverse Methods in Plasticity Applications in Experimental Mechanics

Full Product Details

Author:   Marco Rossi ,  Marco Sasso ,  Nathanael Connesson ,  Raman Singh
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
Weight:   9.412kg
ISBN:  

9783319376493

ISBN 10:   3319376497
Pages:   377
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.

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