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OverviewRapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field. Full Product DetailsAuthor: Victor E. Borisenko , Peter J. HeskethPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 1997 Dimensions: Width: 15.50cm , Height: 2.00cm , Length: 23.50cm Weight: 0.587kg ISBN: 9781489918062ISBN 10: 148991806 Pages: 358 Publication Date: 20 June 2013 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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