Proceedings of the Seventh Asia International Symposium on Mechatronics: Volume I

Author:   Baoyan Duan ,  Kazunori Umeda ,  Woonbong Hwang
Publisher:   Springer Verlag, Singapore
Edition:   1st ed. 2020
Volume:   588
ISBN:  

9789813294394


Pages:   1034
Publication Date:   02 September 2020
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Proceedings of the Seventh Asia International Symposium on Mechatronics: Volume I


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This book presents high-quality papers from the Seventh Asia International Symposium on Mechatronics (AISM 2019). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design for electronic equipment, sensing and measurement, mechatronics in manufacturing and automation, micro-mechatronics, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed here provide excellent reference material for future product developments.

Full Product Details

Author:   Baoyan Duan ,  Kazunori Umeda ,  Woonbong Hwang
Publisher:   Springer Verlag, Singapore
Imprint:   Springer Verlag, Singapore
Edition:   1st ed. 2020
Volume:   588
Weight:   1.579kg
ISBN:  

9789813294394


ISBN 10:   9813294396
Pages:   1034
Publication Date:   02 September 2020
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Prof.Baoyan Duan, Academician of Chinese Academy of Engineering, IET Fellow, awardees of science and technology achievement award by Ho Leung Ho lee Foundation. He is the Chief Scientist of 973 project, Fellow of Electronic Institute of China, Chairman of Chinese Association of Electromechanical Engineering, and Chairman of Antenna Industry Association of China. So far he is the full professor of electromechanical engineering of Xidian University and also the president of Xidian University during 2002-2012.   He has been worked for both of teaching and researching of electromechanical engineering, focused on the coupling and integration between electronic and mechanical techniques. It is he who pioneers a new field of electromagnetic-structural deformation-thermo coupling of electronic equipment in China. Firstly he developed a two-field-coupling model between electromagnetic and structural deformation of microwave reflector antennas. He has proposed systematic optimization method of homologous design of the reflector. Secondly the integrated design theory and methodology of servomechanism of radar and antenna are developed in order to solve the problem of mechanical factors affecting the pointing accuracy. An innovation design for 500 meters diameter large telescope is proposed, Initiating a new way that a flexible structure composed of long cable is utilize to dynamic positioning the feed three dimensionally. Thirdly the electromagnetic-structural deformation-thermo coupled model is presented for typical electronic equipments. The model reveals the relationship among the fields. The above key technology and program system have been successfully applied in many engineering projects such as space shipping, survey of deep space, the main warship and so on.  As the first receiver, he has obtained the 2nd prize award of national science and technology three times, and the 1st prize award of provincial level of science and technology three times. He has published 150 papers that are cited by SCI and EI, and 5 books. The paper and book have been referenced 3600. He has made 23 patents of invention. Among his graduated Ph. D. students, one received the excellent Ph.D. dissertation of China, one gotten Humboldt prize of Germany and one received provincial outstanding contributions experts of Shaanxi province.   He is the member of scientific and technology committee of China education bureau, China industry and information bureau, and China general armament department.

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