Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Author:   ASME
Publisher:   American Society of Mechanical Engineers,U.S.
ISBN:  

9780791885505


Pages:   648
Publication Date:   30 May 2022
Format:   Paperback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)


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Overview

The proceedings of InterPACK2021 explore the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Full Product Details

Author:   ASME
Publisher:   American Society of Mechanical Engineers,U.S.
Imprint:   American Society of Mechanical Engineers,U.S.
Weight:   1.210kg
ISBN:  

9780791885505


ISBN 10:   079188550
Pages:   648
Publication Date:   30 May 2022
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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