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OverviewA new edition of this industry classic on the principles of plasma processing Plasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential. Principles of Plasma Discharges and Materials Processing is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields. Readers of the third edition of Principles of Plasma Discharges and Materials Processing will also find: Extensive figures and tables to facilitate understanding A new chapter covering the recent development of processes involving high-pressure capacitive discharges New subsections on discharge and processing chemistry, physics, and diagnostics Principles of Plasma Discharges and Materials Processing is ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field. Full Product DetailsAuthor: Michael A. Lieberman, PhD (University of California, Berkeley) , Allan J. Lichtenberg (University of California, Berkeley)Publisher: John Wiley & Sons Inc Imprint: John Wiley & Sons Inc Edition: 3rd edition Dimensions: Width: 18.50cm , Height: 4.80cm , Length: 25.70cm Weight: 1.315kg ISBN: 9781394245376ISBN 10: 1394245378 Pages: 832 Publication Date: 16 August 2024 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsList of Figures xxi List of Tables xlv Preface to Third Edition xlvii Preface to Second Edition xlix Preface to the First Edition li Symbols, Abbreviations, and Acronyms Iv 1 Introduction 1 1.1 Materials Processing 1 1.2 Plasmas and Sheaths 5 1.3 Discharges 12 1.4 Symbols and Units 20 2 Basic Plasma Equations and Equilibrium 21 2.1 Introduction 21 2.2 Field Equations, Current, and Voltage 22 2.3 The Conservation Equations 25 2.4 Equilibrium Properties 30 Problems 34 3 Atomic Collisions 37 3.1 Basic Concepts 37 3.2 Collision Dynamics 42 3.3 Elastic Scattering 46 3.4 Inelastic Collisions 53 3.5 Averaging Over Distributions and Surface Effects 64 Problems 68 4 Plasma Dynamics 73 4.1 Basic Motions 73 4.2 Nonmagnetized Plasma Dynamics 77 4.3 Guiding Center Motion 84 4.4 Dynamics of Magnetized Plasmas 90 4.5 Waves in Magnetized Plasmas 93 4.6 Microwave and RF Field Diagnostics 100 Problems 107 5 Diffusion and Transport 111 5.1 Basic Relations 111 5.2 Diffusion Solutions 113 5.3 Low-Pressure Solutions 119 5.4 Diffusion Across a Magnetic Field 123 5.5 Magnetic Multipole Confinement 129 Problems 133 6 dc Sheaths 137 6.1 Basic Concepts and Equations 137 6.2 The Bohm Sheath Criterion 139 6.3 The High-Voltage Sheath 145 6.4 Generalized Criteria for Sheath Formation 147 6.5 High-Voltage Collisional Sheaths 152 6.6 Electrostatic Probe Diagnostics 153 Problems 167 7 Chemical Reactions and Equilibrium 171 7.1 Introduction 171 7.2 Energy and Enthalpy 172 7.3 Entropy and Gibbs Free Energy 179 7.4 Chemical Equilibrium 184 7.5 Heterogeneous Equilibrium 187 Problems 191 8 Molecular Collisions 195 8.1 Introduction 195 8.2 Molecular Structure 195 8.3 Electron Collisions with Molecules 202 8.4 Heavy-Particle Collisions 211 8.5 Reaction Rates and Detailed Balancing 221 8.6 Optical Emission and Actinometry 229 Problems 237 9 Chemical Kinetics and Surface Processes 243 9.1 Elementary Reactions 243 9.2 Gas-Phase Kinetics 246 9.3 Surface Processes 253 9.4 Surface Kinetics 263 9.5 Showerhead Gas Flow 270 Problems 273 10 Particle and Energy Balance in Discharges 279 10.1 Introduction 279 10.2 Electropositive Plasma Equilibrium 281 10.3 Electronegative Plasma Equilibrium 289 10.4 Approximate Electronegative Equilibria 297 10.5 Electronegative Discharge Experiments and Simulations 304 10.6 Pulsed Discharges 313 Problems 324 11 Low-Pressure Capacitive Discharges 329 11.1 Homogeneous Model 330 11.2 Inhomogeneous Model 340 11.3 Experiments and Simulations 353 11.4 Asymmetric Discharges 365 11.5 Voltage-Driven Sheaths and Series Resonance 369 11.6 Multi-frequency Capacitive Discharges 372 11.7 Standing Wave and Skin Effects 383 11.8 Low-Frequency Sheaths 391 11.9 Ion-Bombarding Energy at Electrodes 394 11.10 Magnetically Enhanced Discharges 401 11.11 Matching Networks and Power Measurements 406 Problems 410 12 Inductive Discharges 415 12.1 High-Density, Low-Pressure Discharges 415 12.2 Other Operating Regimes 422 12.3 Planar Coil Configuration 430 12.4 High-Efficiency Planar Discharges 436 Problems 441 13 Wave-Heated Discharges 445 13.1 Electron Cyclotron Resonance Discharges 445 13.2 Helicon Discharges 464 13.3 Surface Wave Discharges 473 Problems 477 14 dc Discharges 479 14.1 Qualitative Characteristics of Glow Discharges 479 14.2 Analysis of the Positive Column 482 14.3 Analysis of the Cathode Region 485 14.4 Hollow Cathode Discharges 492 14.5 Planar Magnetron Discharges 498 14.6 Ionized Physical Vapor Deposition 507 Problems 510 15 High-Pressure Capacitive Discharges 513 15.1 Introduction 513 15.2 Intermediate Pressure RF Discharges 514 15.3 Alpha-to-Gamma (α–γ) Transition 524 15.4 Atmospheric Pressure RF Discharges 534 15.5 Atmospheric Pressure Low-Frequency Discharges 548 Problems 556 16 Etching 561 16.1 Etch Requirements and Processes 561 16.2 Etching Kinetics 568 16.3 Halogen Atom Etching of Silicon 575 16.4 Other Etch Systems 588 16.5 Atomic Layer Etching (ALE) 595 16.6 Substrate Charging 608 Problems 616 17 Deposition and Implantation 619 17.1 Introduction 619 17.2 Plasma-Enhanced Chemical Vapor Deposition 621 17.3 Atomic Layer Deposition 628 17.4 Sputter Deposition 636 17.5 Plasma-Immersion Ion Implantation 640 Problems 651 18 Dusty Plasmas 655 18.1 Qualitative Description of Phenomena 655 18.2 Particle Charging and Discharge Equilibrium 656 18.3 Particulate Equilibrium 662 18.4 Formation and Growth of Dust Grains 665 18.5 Physical Phenomena and Diagnostics 670 18.6 Removal or Production of Particulates 675 Problems 677 19 Kinetic Theory of Discharges 681 19.1 Basic Concepts 681 19.2 Local Kinetics 690 19.3 Nonlocal Kinetics 693 19.4 Quasilinear Diffusion and Stochastic Heating 697 19.5 Energy Diffusion in a Skin Depth Layer 703 19.6 Kinetic Modeling of Discharges 707 Problems 714 Appendix A Collision Dynamics 717 A.1 Coulomb Cross Section 718 Appendix B The Collision Integral 721 B.1 Boltzmann Collision Integral 721 B.2 Maxwellian Distribution 722 Appendix C Diffusion Solutions for Variable Mobility Model 723 References 727 Index 749ReviewsAuthor InformationMichael A. Lieberman, PhD, is Professor of the Graduate School, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley. Allan J. Lichtenberg, PhD, was Emeritus Professor of the Department of Electrical Engineering and Computer Sciences, University of California, Berkeley. Tab Content 6Author Website:Countries AvailableAll regions |
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