Overview

Foreword by Joungho Kim   The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts   In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability.   After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics.   Coverage includes • The exponentially growing challenge of I/O power integrity in high-speed digital systems • PDN noise analysis and its timing impact for single-ended and differential interfaces • Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity • Time domain gauges for designing and optimizing components and systems • Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance • Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions • Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects   Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Full Product Details

Author:   Vishram S. Pandit ,  Woong Hwan Ryu ,  Myoung Joon Choi
Publisher:   Pearson Education (US)
Imprint:   Prentice Hall
Dimensions:   Width: 18.30cm , Height: 3.10cm , Length: 24.10cm
Weight:   0.780kg
ISBN:  

9780137011193

ISBN 10:   0137011199
Pages:   416
Publication Date:   21 October 2010
Audience:   College/higher education ,  Tertiary & Higher Education
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   Awaiting stock  

Table of Contents

Foreword by Joungho Kim     xiii Preface     xv About the Authors     xxi   Chapter 1  Introduction     1 1.1 Digital Electronic System     1 1.2 I/O Signaling Standards     2      1.2.1 Single-Ended and Differential Signaling     3 1.3 Power and Signal Distribution Network     5 1.4 Signal and Power Integrity     6 1.5 Power Noise to Signal Coupling     8      1.5.1 SSO     9      1.5.2 Chip-Level SSO Coupling     9      1.5.3 Interconnect Level SSO Coupling     10 1.6 Concurrent Design Methodology     12 References     13   Chapter 2  I/O Interfaces     15 2.1 Single-Ended Drivers and Receivers     15      2.1.1 Open Drain Drivers     16      2.1.2 Push-Pull Driver and Receiver     17      2.1.3 Termination Schemes for a Single-Ended System     18      2.1.4 Current Profiles in a Push-Pull Driver     18           Push-Pull Driver with CTT     19           Push-Pull Driver with Power Termination     22      2.1.5 Noise for Push-Pull Driver     25 2.2 Differential Drivers and Receivers     26      2.2.1 Termination Schemes for Differential System     28      2.2.2 Current Profiles in Half Differential Driver     30      2.2.3 Noise for Half Differential Driver     32 2.3 Prior Stages of I/O Interface     34 References     35   Chapter 3  Electromagnetic Effects     37 3.1 Electromagnetic Effects on Signal/Power Integrity     37 3.2 Electromagnetic Theory     39      3.2.1 Maxwell’s Equations     40 3.3 Transmission Line Theory     46 3.4 Interconnection Network Parameters: Z,Y,S and ABCD     55      3.4.1 Impedance Matrix [Z]     56      3.4.2 Admittance Matrix [Y]     57      3.4.3 The Scattering Matrix [S]     57      3.4.4 The Scattering Matrix [S]     with Arbitrary Loads 59      3.4.5 Relation Between Scattering Matrix [S] and Y/Z/ABCD Matrix    61 3.5 LTI System     64      3.5.1 Reciprocal Network     64      3.5.2 Parameter Conversion Singularity     64      3.5.3 Stability     65      3.5.4 Passivity     65      3.5.5 Causality    67 References     67   Chapter 4  System Interconnects     69 4.1 PCB Technology     69 4.2 Package Types     70 4.3 Power Distribution Network    73      4.3.1 PCB PDN     73           Power Supply    74           DC/DC Converter     75           PCB Capacitors    76           PCB Power/Ground Planes    81           Impact of Vias     87           Stitching Domains Together     90      4.3.2 Package Power Distribution Network     92    4.3.3 On-Chip Power Network     93           Intentional Capacitors    94           Unintentional Capacitors     96 4.4 Signal Distribution Network     97      4.4.1 PCB/ Package Physical Signal Routing    97           Microstrip Line    97           Stripline     100           Co-Planar Waveguide     101           Coupled Lines     102      4.4.2 Package Signal Distribution Network     107      4.4.3 PCB/Package Material Properties     108           Electrical Properties of Metal     108           Electrical Properties of Dielectrics     110           Frequency-Dependent Parameters of Microstrip Line    111      4.4.4 On-Chip Signal Network     112 4.5 Interaction Between Interconnect Systems     115      4.5.1 Reference, Ground, and Return Paths     116      4.5.2 Referencing: Single-Ended and Differential Signaling     116      4.5.3 Power to Signal Coupling     118 4.6 Modeling Tools for the PDN and Signal Networks     119 References     122   Chapter 5  Frequency Domain Analysis     127 5.1 Signal Spectrum     128      5.1.1 Fourier Transform Interpretation     132      5.1.2 Important Properties of the Fourier Transform     134           Interpreting and Using Frequency Domain Representations of Waveforms     134           Key Properties of Fourier Transforms (of Interest in SI)     134           Fourier Transform Examples and Interpretation     135           Trapezoidal Pulse Fourier Transform Tool     138      5.1.3 FFT of Power Noise     141      5.1.4 Convolution and Filtering     142 5.2 Signal and Power Integrity Applications     143      5.2.1 S-Parameters with Global and Local Ground     145 5.3 Power Distribution Network Design in Frequency Domain     147      5.3.1 Impedance Response Z11     148      5.3.2 Impedance Targets for I/O Interface     150           Single-Ended Driver     151           Differential Driver     152           Prior Stages     152      5.3.3 PDN Design Example     153           Package and PCB PDN     154           PDN Co-Design: PCB, Package and Chip    155      5.3.4 On-Chip Power Delivery: Modeling and Characterization     158           Test Vehicle for On-Chip PDN     159           2D TLM Empirical On-Chip PD Modeling Method    161           On-Chip Capacitor Model Extraction     162           Modeling and Correlation for On-Chip PDN of the I/O Interface    163           EM Modeling of On-Chip PDN     165      5.3.5 Insertion Loss and Voltage Transfer Function     166      5.3.6 SSO in Frequency Domain     168      5.3.7 Power-to-Signal Coupling     170 5.4 Signal Network Design in Frequency Domain     171      5.4.1 Frequency Domain Optimization     172      5.4.2 Simulation and Correlation of Signal Network     174      5.4.3 Case Study: Crosstalk Amplification by Resonance     175           Model Correlation     177           Self-Impedance and Insertion Loss for the Entire Channel     180           Voltage Transfer Function for the Victim Bit     181           Far-End Crosstalk     182           Self-Impedance and Transfer Impedance with Different Enablers    183      5.4.4 Differential Signaling in Frequency Domain     184 References     190   Chapter 6  Time Domain Analysis     193 6.1 Time Domain Modeling and Simulation     193      6.1.1 Transient Simulations     195      6.1.2 Buffer Modeling     196           IBIS and VCR Models     196 6.2 Simulation for Optimization     198      6.2.1 Power Delivery Time Domain Specification     198      6.2.2 Controllable Design Variables for Optimization     200           Geometry and Material     201           Passive Components on PCB and Package     203           On-Chip Design Variables     203 6.3 PDN Noise Simulations     204      6.3.1 VR Tolerance and IR Drop     204      6.3.2 AC Noise Analysis     207           Supply Droop and Resonance     207      6.3.3 Internal Circuits     209      6.3.4 Final Stage Circuits     210      6.3.5 Single-Ended Systems     212           Correlation with Measurements     214           Noise Measurements at the Receiver     215      6.3.6 Differential Systems     217      6.3.7 Logic Stage     220 6.4 Jitter Impact for Time Domain Analysis     221      6.4.1 Jitter Impact Due to PDN Noise     222      6.4.2 Jitter Due to the SSO     223           Single-Ended System     223           Differential System     228 References     231   Chapter 7  Signal/Power Integrity Interactions     233 7.1 Background     234 7.2 Root Cause Analysis     236 7.3 SSO Coupling Mechanism     238 7.4 Case Study I: DDR2 800 Control Signal     241      7.4.1 Noise Source     243      7.4.2 Coupling Mechanism     244      7.4.3 Resonant Structure on Control Networks     245      7.4.4 Proposed Solutions     247 7.5 Case Study II: DDR2 667 Vref Bus     248      7.5.1 Noise Source     249      7.5.2 Coupling Mechanism     249      7.5.3 Resonance Structure     250      7.5.4 Proposed Solutions     252 7.6 Referencing/Stitching/Decoupling Effects--Single-Ended Interface     258 7.7 Stitching Effects--Differential Interface     263      7.7.1 VNA Measurement Results     271      7.7.2 Modeling and Measurement Correlations     273      7.7.3 System-Level Impact Evaluation     274 7.8 EMI Trade-Off     276      7.8.1 Power Islands Radiation     276 References     282   Chapter 8  Signal/Power Integrity Co-Analysis     285 8.1 Identifying Controllable Parameters     286 8.2 SI-PI Modeling and Simulation     288      8.2.1 Modeling SI-PI Compatible Buffers     288      8.2.2 Modeling On-Chip Passive Components     290      8.2.3 Modeling Off-Chip Passive Components     291      8.2.4 Model Check and Integration     291      8.2.5 Construction of SI-PI Co-Simulation     292      8.2.6 PDN Resonance Excitation of Driver Bit Pattern     292      8.2.7 Worst-Case Eye     294      8.2.8 Running SI-PI Co-Simulation     296           ISI and Minimal ISI     297           ISI and SSO     298           ISI and Crosstalk     299           ISI, SSO, and Crosstalk     299 8.3 SI-PI Co-Analysis     301      8.3.1 Time Domain Analysis     301           Optimization Using Sweep Parameters and Noise Decomposition     302           Simple Comparison of Eye     305      8.3.2 Eye Diagram Analysis     308      8.3.3 Linear Interaction Indicator     309           Single-Ended Signaling SI-PI Performance and Linearity     315           Differential Signaling SI-PI Performance and Linearity     317           SI-PI Linear Interaction Indicator     319 8.4 SI-PI Co-Simulation and Co-Analysis Flow: Summary     321 References     322   Chapter 9  Measurement Techniques     325 9.1 Frequency Domain Characterization     325      9.1.1 Vector Network Analyzer (VNA)     326      9.1.2 Smith Chart     327      9.1.3 Low-Impedance VNA Measurement for Power Delivery Network     329      9.1.4 On-Chip Characterization     335           On-Chip Interconnect 2D Modeling and Correlation     338           On-Chip Interconnection Line Performance Versus Different Structures     345           On-Chip PDN Characterization     349      9.1.5 Pad Capacitance Characterization     350           Lower- and Upper-Frequency Limit     350           De-Embedding Method     351      9.1.6 Power Delivery-to-Signal Coupling Measurement     353 9.2 Equivalent Circuit Model Extraction     355      9.2.1 Need for an Equivalent Circuit Model     355           Validation Purpose     355           Simulation Purpose     356      9.2.2 Extraction Methodology     357 Numerical Error     358      9.2.3 Extraction Examples     358           Receiver Model for SI     358           PDN Model     360           Topology Identification     360      9.2.4 Extension to Multiport Measurement     361 9.3 Time Domain Characterization     361      9.3.1 Time Domain Reflectometry (TDR)     361           Development of 9ps TDR Measurement Setup     363           Package Validation Using TDR     365           Differential TDR and TDT     371      9.3.2 PDN Noise Measurement     372      9.3.3 SSO Coupling Measurement in Time Domain     376      9.3.4 Jitter Measurement     379 References     380   Index     383  

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Author Information

Vishram S. Pandit is a technical lead in the Signal/Power Integrity Engineering team at Intel Corporation. He works on developing power delivery designs for high-speed interfaces. His focus areas include high-speed system power delivery, on-chip power delivery, and Signal/ Power Integrity co-design. Prior to Intel he worked at Hughes Network Systems on Electromagnetic Interference (EMI), Electromagnetic Compatibility (EMC), power integrity, and signal integrity technologies. He has received a B.E. (Instrumentation) from College of Engineering, Pune, India, an M.S. (Electrical Engineering) from University of Utah, USA, and an Advanced Certificate for Post-Master’s Study (Computer Science) from Johns Hopkins University, USA. He is a senior member of IEEE and a member of the CPMT Technical Committee on Electrical Design, Modeling and Simulation; and he serves as a technical program committee member for DesignCon. He was a recipient of the International Engineering Consortium’s paper awards for DesignCon 2008 and DesignCon 2009.   Woong Hwan Ryu is currently a Signal/Power Integrity Engineering Manager at Intel Corporation. He has been responsible for pre-silicon signal integrity and power integrity analysis for high speed interfaces. He received his Ph.D. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST). Dr. Ryu holds an IEEE Senior Member status; he serves as a reviewer for several IEEE journals; and he serves as a technical program committee member and organizing committee member for DesignCon. He was a recipient of the International Engineering Consortium’s paper awards for DesignCon 2006 and DesignCon 2008. Dr. Ryu has authored and co-authored more than 80 technical publications in premier journals and international conferences, and holds three issued patents and has one patent pending.   Myoung Joon Choi is a technical lead in the Signal/Power Integrity Engineering team at Intel Corporation. He works on developing methodologies for high-speed interface simulation and analysis. His focus areas include high-speed system SI-PI co-simulation, on-chip signal and power integrity, and computational analysis of entire high-speed systems. Dr. Choi has received a Ph.D. and an M.S. from University of Illinois at Urbana-Champaign, Urbana, IL, USA, and a BS from Korea University, Seoul, Korea. He has authored and co-authored many technical publications in journals and conferences.  

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