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Author:   Kash L. Mittal ,  Kash Mittal
Publisher:   Brill
Imprint:   VSP International Science Publishers
Volume:   8
Dimensions:   Width: 15.60cm , Height: 2.00cm , Length: 23.40cm
Weight:   0.748kg
ISBN:  

9789067643924

ISBN 10:   9067643920
Pages:   352
Publication Date:   01 December 2003
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Preface Part 1: Particle Analysis / Characterization and General Cleaning-Related Topics The nature and characterization of small particles R. Kohli Surface and micro-analytical methods for particle identification D.A. Cole, J. Humenansky, M. Kendall, P.J. McKeown, V. Pajcini and J.H. Scherer The haze of a wafer: A new approach to monitor nano-sized particles K. Xu, R. Vos, G. Vereecke, M. Lux, W. Fyen, F. Holsteyns, K. Kenis, P.W. Mertens, M.M. Heyns and C. Vinckier Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process C.C. Walton, D.J. Rader, J.A. Folta and D.W. Sweeney Particle deposition from a carry-over layer during immersion rinsing W. Fyen, K. Xu, R. Vos, G. Vereecke, P. Mertens and M. Heyns The use of surfactants to reduce particulate contamination on surfaces M.L. Free The use of rectangular jets for surface decontamination E.S. Geskin and B. Goldenberg Ice-air blast cleaning: Case studies D. Shishkin, E. Geskin, B. Goldenberg and O. Petrenko Development of a technique for glass cleaning in the course of demanufacturing of electronic products E.S. Geskin, B. Goldenberg and R. Caudill Part 2: Particle Adhesion and Removal Mechanics of nanoparticle adhesion — A continuum approach J. Tomas A new thermodynamic theory of adhesion of particles on surfaces M.A. Melehy Particle adhesion on nanoscale rough surfaces B.M. Moudgil, Y.I. Rabinovich, M.S. Esayanur and R.K. Singh Advanced wet cleaning of sub-micrometer sized particles R. Vos, K. Xu, G. Vereecke, F. Holsteyns, W. Fyen, L. Wang, J. Lauerhaas, M. Hoffman, T. Hackett, P. Mertens and M. Heyns Modified SC-1 solutions for silicon wafer cleaning C. Beaudry, J. Baker, R. Gouk and S. Verhaverbeke Investigation of ozonated DI water in semiconductor wafer cleaning J. DeBello and L. Liu Possible post-CMP cleaning processes for STI ceria slurries R. Small and B. Scott The ideal ultrasonic parameters for delicate parts cleaning T. Piazza and W.L. Puskas Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers S.L. Wicks, M.S. Lucey and J.J. Rosato Influences of various parameters on microparticles removal during laser surface cleaning Y.F. Lu, Y.W. Zheng, L. Zhang, B. Luk’yanchuyk, W.D. Song and W.J. Wang Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer T. Hooper, Jr. and C. Cetinkaya Particle removal by collisions with energetic clusters J. Perel, J. Mahoney, P. Kopalidis and R. Becker

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