Overview

This volume reviews the practical aspects of electrical and thermal modelling of GaAs wireless applications, discussing analogue (microwave) packaging as opposed to digital packaging. It emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modelling as a significant cost-cutting tool is high. This text addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging should find this book interesting and of value to their work.

Full Product Details

Author:   Dean L. Monthei
Publisher:   Springer
Imprint:   Springer
Edition:   1999 ed.
Volume:   2
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   1.170kg
ISBN:  

9780792383642

ISBN 10:   0792383648
Pages:   234
Publication Date:   30 November 1998
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

I High Frequency Issues.- 1 Tutorial On Microwave Concepts.- 2 The Smith Chart and S-Parameters.- II Electrical Modeling of Packages.- 3 Equivalent Circuit Models.- 4 Creating Models From Measurements.- 5 Creating a Model Using Em Simulators.- III Thermal Modeling.- 6 Basics of Thermal Analysis.- 7 Quick Thermal Analysis.- 8 Finite Element Analysis.- 9 Computational Fluid Dynamics.- 10 Transient Thermal.- 11 Thermal Measurements.- IV Processing Issues With Packaging Gaas High Frequency Components.- 12 Package Families for Wireless.- 13 Optimizing Electrical Performance.- 14 Production Process Issues.- 15 Die Attach Issues.- Appendix A Electrical Conductivities of Packaging Materials.- Appendix B Dielectric Properties of Packaging Materials.- Appendix C Thermal Conductivities of Packaging Materials.- Appendix D Thermal Modeling Software And Information.- Appendix E Thermal Analysis Equipment And Materials.- Appendix F Electromagnetic Simulator Software.- Appendix G Electrical Probing Tools.- Appendix H Circuit Simulator Software.

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