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OverviewThis book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field. Full Product DetailsAuthor: James E. MorrisPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2009 Dimensions: Width: 15.50cm , Height: 2.90cm , Length: 23.50cm Weight: 0.866kg ISBN: 9781441942906ISBN 10: 1441942904 Pages: 543 Publication Date: 05 November 2010 Audience: Professional and scholarly , Professional & Vocational Replaced By: 9783319903613 Format: Paperback Publisher's Status: Out of Print Availability: In Print  Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock. Table of ContentsReviewsFrom the reviews: This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ... I am pleased to be able to conclude this ... Nanopackaging: Nanotechnologies and Electronics Packaging as `highly recommended'. (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009) From the reviews: This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ! I am pleased to be able to conclude this ! Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'. (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009) Author InformationTab Content 6Author Website:Countries AvailableAll regions |
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