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OverviewFull Product DetailsAuthor: Yu Zhu , Andreas C. CangellarisPublisher: John Wiley & Sons Inc Imprint: Wiley-IEEE Press Dimensions: Width: 18.60cm , Height: 2.70cm , Length: 25.70cm Weight: 0.901kg ISBN: 9780471741107ISBN 10: 0471741108 Pages: 448 Publication Date: 07 March 2006 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsList of Figures. List of Tables. Preface. Acknowledgments. 1. Introduction. 2. Hierarchical Basis Functions for Triangles and Tetrahedra. 3. Finite Element Formulations of Electromagnetic BVPs. 4. Iterative Methods, Preconditioners, and Multigrid. 5. Nested Multigrid Preconditioner. 6. Nested Multigrid Vector and Scaler Potential Preconditioner. 7. Hierarchical Multilevel and Hybrid Potential Preconditioners. 8. Krylov-Subspace Based Eigenvalue Analysis. 9. Two-Dimensional Eigenvalue Analysis of Waveguides. 10. Three-Dimensional Eigenvalue Analysis of Resonators. 11. Model Order Reduction of Electromagnetic Systems. 12. Finite Element Analysis of Periodic Structures. Appendix A: Identities and Theorems from Vector Calculus. Index.ReviewsAuthor InformationDr.Yu Zhu has been a member of the consulting staff in Custom IC at Cadence Design Systems, Inc. since 2002. He earned his B.S. in Electrical Engineering at Nanjing University in 1995, his M.S. at Ohio State University in 1998, and his Ph.D. at University of Illinois @ Urbana-Champaign in 2002. He is a member of the IEEE and SigmaXi. Dr. Andreas Cangellaris has been a full professor at University of Illinois @ Urbana-Champaign since 1997. His research work has been in the area of applied and computational electromagnetics with emphasis on thier application to electrical modeling simulation of RF/microwave components and systems, high-speed digital interconnects at the board, package, and chip level, as well as the modeling and simulation of electromagnetic compatibility and electromagnetic interference. He has co-authored more than 150 refereed papers and three book chapters on topics related to computational electromagnetics and interconnects and package modeling and simulation. He was elected a Fellow of the IEEE in January 2000. Tab Content 6Author Website:Countries AvailableAll regions |