Overview

This book offers engineers a practical guide to the best suited power amplifier modules for a particular application, and explores how to interface the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems. This volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.

Full Product Details

Author:   Howard Hausman
Publisher:   Artech House Publishers
Imprint:   Artech House Publishers
Edition:   Unabridged edition
ISBN:  

9781630813468

ISBN 10:   163081346
Pages:   280
Publication Date:   30 June 2018
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Part One: Useful Microwave Design Concepts -- Lumped Components in RF and Microwave Circuitry. Transmission Lines. S-Parameters. Microstrip Transmission Lines. Circuit Matching and VSWR. Noise in Microwave Circuits. Non-Linear Signal Distortion. System Cascade and Dynamic Range Analysis. Part Two: Designing the Power Amplifier -- Defining the Output Power Requirements for a Communication Link and Other Wireless Systems. Parallel Amplifier Topology Enhancing SSPA Performance. MMIC Amplifier Modules for Use in Parallel Combining Circuits. Measuring and Matching the Impedance of High Power MMIC Amplifier Modules. Power Dividers and Combiners Used in Parallel Amplifier SSPAs. Power Amplifier Chain Analysis. Part Three: Designing the Power Amplifier System -- RF Signal Monitoring Circuits. DC Power Interface with the RF Signal Path. SSPA DC Voltage and Current. Thermal Design and Reliability. Electromagnetic Interference (EMI). Appendices. Index.

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Author Information

Howard Hausman is a senior principal engineer at L3-narda-MITEQ. He is also an adjunct professor at Hofstra University in the School of Engineering. He holds an M.S in electrical engineering from the NYU Tandon School of Engineering.

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