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OverviewThe recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics. Full Product DetailsAuthor: Mailadil T. Sebastian (University of Oulu, Finland) , Rick Ubic (Boise State University, USA) , Heli Jantunen (University of Oulu, Finland) , Mailadil T. SebastianPublisher: John Wiley & Sons Inc Imprint: John Wiley & Sons Inc Dimensions: Width: 18.00cm , Height: 6.60cm , Length: 26.20cm Weight: 2.177kg ISBN: 9781119208525ISBN 10: 1119208521 Pages: 1008 Publication Date: 05 May 2017 Audience: Professional and scholarly , College/higher education , Professional & Vocational , Undergraduate Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationEdited by M. T. Sebastian Faculty of Information Technology and Electrical Engineering, University of Oulu, Finland Rick Ubic Micron School of Materials Science and Engineering, Boise State University, USA Heli Jantunen Faculty of Information Technology and Electrical Engineering, University of Oulu, Finland Tab Content 6Author Website:Countries AvailableAll regions |
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