Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies

Author:   Vadim Issakov
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Edition:   2010 ed.
ISBN:  

9783642135972


Pages:   208
Publication Date:   14 August 2010
Format:   Hardback
Availability:   In Print   Availability explained
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Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies


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Overview

There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.

Full Product Details

Author:   Vadim Issakov
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Edition:   2010 ed.
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   0.547kg
ISBN:  

9783642135972


ISBN 10:   3642135978
Pages:   208
Publication Date:   14 August 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Vadim E. Issakov (M'07) was born on August 10, 1981 in The Russian Federation. In 2006 he received the M.Sc. degree (cum laude) in microwave engineering from the Technical University Munich, Germany. From 2006 to 2010, he worked towards the Ph.D. degree as a Research Assistant in the Institute of Electrical Engineering and Information Technology, Department for High-Frequency Electronics at the University of Paderborn, Germany. Currently he is with Infineon Technologies AG.

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