Microelectronics Packaging Handbook: Technology Drivers Part I

Author:   R.R. Tummala ,  Eugene J. Rymaszewski ,  Alan G. Klopfenstein
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 2nd ed. 1997
ISBN:  

9781461368298


Pages:   720
Publication Date:   23 October 2012
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Microelectronics Packaging Handbook: Technology Drivers Part I


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Overview

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Full Product Details

Author:   R.R. Tummala ,  Eugene J. Rymaszewski ,  Alan G. Klopfenstein
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 2nd ed. 1997
Dimensions:   Width: 15.50cm , Height: 3.80cm , Length: 23.50cm
Weight:   1.133kg
ISBN:  

9781461368298


ISBN 10:   1461368294
Pages:   720
Publication Date:   23 October 2012
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

1. Microelectronics Packaging Handbook: Technology Drivers.- 1. Microelectronics Packaging—An Overview.- 2. Package Wiring and Terminals.- 3. Package Electrical Design.- 4. Heat Transfer in Electronic Packages.- 5. Package Reliability.- 6. Package Manufacture.- Glossary and Symbols.- Authors’ Biographies.

Reviews

'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997


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