Overview

The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi­ control techniques, test, diagnostics, and fail­ ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per­ and reducing defects, and for preventing de­ formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how­ applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De­ of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func­ Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re­ of Technology Products General Manager duction in the microelectronics world.

Full Product Details

Author:   Abraham Landzberg
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1993
Dimensions:   Width: 17.80cm , Height: 3.40cm , Length: 25.40cm
Weight:   1.259kg
ISBN:  

9781461358404

ISBN 10:   146135840
Pages:   633
Publication Date:   05 November 2012
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Foreword; Preface; Author's biographies; Acknowledgments; Introduction; Manufacturing yield; Problem diagnosis; Manufacturing defect classification system; Product dimensional metrology and pattern defect inspection; Process and tool monitoring; Contamination monitoring; Repair and rework; Test sites and vehicles for yield and process monitoring; In-line electrical test; Traceability; Failure analysis of semiconductor devices; Materials and chemical analysis of electronic devices; Modeling for manufacturing diagnostics; Artificial intelligence techniques for analysis: expert systems and neural networks; Statistical quality control; Reliability/defect severity; Burn-in; Defect prevention; Index

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