Metal-Dielectric Interfaces in Gigascale Electronics: Thermal and Electrical Stability

Author:   Ming He ,  Toh-Ming Lu
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2012
Volume:   157
ISBN:  

9781493943081


Pages:   149
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Our Price $290.37 Quantity:  
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Metal-Dielectric Interfaces in Gigascale Electronics: Thermal and Electrical Stability


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Overview

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying  the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate  interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics  provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Full Product Details

Author:   Ming He ,  Toh-Ming Lu
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2012
Volume:   157
Dimensions:   Width: 15.50cm , Height: 0.90cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9781493943081


ISBN 10:   1493943081
Pages:   149
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Preface.- 1. Introduction.- 2. Metal-Dielectric Diffusion Processes: Fundamentals.- 3. Experimental Techniques.- 4. Al-Dielectric Interfaces.- 5. Cu-Dielectric Interfaces.- 6. Barrier Metal-Dielectric Interfaces.- 7. Self-Forming Barriers. 8. Kinetics of Ion Drift.- 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions.

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