MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics

Author:   Gordon Shaw III ,  Barton C. Prorok ,  LaVern Starman ,  Cosme Furlong
Publisher:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
ISBN:  

9783319345628


Pages:   134
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics


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Overview

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Full Product Details

Author:   Gordon Shaw III ,  Barton C. Prorok ,  LaVern Starman ,  Cosme Furlong
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
Dimensions:   Width: 21.00cm , Height: 0.80cm , Length: 27.90cm
Weight:   3.685kg
ISBN:  

9783319345628


ISBN 10:   3319345621
Pages:   134
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.

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