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OverviewAlthough materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Full Product DetailsAuthor: Deborah D.L. Chung (Composite Materials Research Laboratory, University at Buffalo, State University of New York.)Publisher: Elsevier Science & Technology Imprint: Butterworth-Heinemann Ltd Dimensions: Width: 16.10cm , Height: 2.20cm , Length: 24.10cm Weight: 0.730kg ISBN: 9780750693141ISBN 10: 0750693142 Pages: 368 Publication Date: 31 March 1995 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Out of Print Availability: In Print  Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock. Table of ContentsReviewsAuthor InformationProfessor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York Tab Content 6Author Website:Countries AvailableAll regions |
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