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Author:   Paul K. Chu (City University of Hong Kong, Kowloon) ,  XinPei Lu (HuaZhong University of Science and Technology, Wuhan, Hubei, People's Republic of China)
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Dimensions:   Width: 17.80cm , Height: 2.80cm , Length: 25.40cm
Weight:   1.080kg
ISBN:  

9781466509900

ISBN 10:   1466509902
Pages:   493
Publication Date:   15 July 2013
Audience:   College/higher education ,  General/trade ,  Tertiary & Higher Education ,  General
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Fundamentals: Introduction. Atmospheric Pressure Plasmas. Processing and Characterization: Modeling of Low-Pressure Plasmas. Modeling of Atmospheric Pressure Plasmas. High-Pressure Microcavity Discharges. Atmospheric Pressure Nanosecond Pulsed Discharge Plasmas. On Atmospheric Pressure Nonequilibrium Plasma Jets. Cavity Ringdown Spectroscopy of Plasma Species. Laser-Induced Fluorescence Methods for Transient Species Detection in High-Pressure Discharges. Applications: Plasma Technology in Silicon Photovoltaics. Environmental Applications of Plasmas. Assessment of Potential Applications of Plasma with Liquid Water. Plasma-Assisted Surface Modification of Polymeric Biomaterials. Emerging Applications of Plasmas in Medicine: Fashion versus Efficacy. Plasma Surface Engineering of Titanium-Based Materials for Osteointegration. Index.

Reviews

This book provides an excellent review of the fundamentals of low temperature plasmas so that those new to this field can get a good understanding as well as learn about recent applications. Students or active professionals working in the area of plasma processing will appreciate the technical breadth, the well-written descriptions, and the abundance of data, graphs, and illustrations that make this book well worth owning. -IEEE Electrical Insulation Magazine, November/December 2014

This book provides an excellent review of the fundamentals of low temperature plasmas so that those new to this field can get a good understanding as well as learn about recent applications. Students or active professionals working in the area of plasma processing will appreciate the technical breadth, the well-written descriptions, and the abundance of data, graphs, and illustrations that make this book well worth owning. -IEEE Electrical Insulation Magazine, November/December 2014

""This book provides an excellent review of the fundamentals of low temperature plasmas so that those new to this field can get a good understanding as well as learn about recent applications. Students or active professionals working in the area of plasma processing will appreciate the technical breadth, the well-written descriptions, and the abundance of data, graphs, and illustrations that make this book well worth owning."" —IEEE Electrical Insulation Magazine, November/December 2014

Author Information

Paul K. Chu is Chair Professor of Materials Engineering in the Department of Physics and Materials Science at the City University of Hong Kong. A fellow of the IEEE, APS, AVS, and HKIE, Dr. Chu is the author of more than 20 book chapters, 900 journal papers, and 800 conference papers and holds numerous patents. He is also the senior editor of IEEE Transactions on Plasma Science, associate editor of Materials Science & Engineering Reports, and an editorial board member of several international journals. His research activities encompass plasma surface engineering and various types of materials and nanotechnology. He received a PhD in chemistry from Cornell University. XinPei Lu is a professor (ChangJiang Scholar) in the College of Electrical and Electronic Engineering at Huazhong University of Science and Technology. A senior member of IEEE, Dr. Lu is the author or coauthor of 50 peer-reviewed journal articles and holds six patents. His research interests include low-temperature plasma sources and their biomedical applications, modeling of low-temperature plasmas, and plasma diagnostics. He received a PhD in electrical engineering from Huazhong University of Science and Technology.

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