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OverviewOver the last forty years, plasma supported processes have attracted ever - creasing interest, and now, all modern semiconductor devices undergo at least one plasma-involved processing step, starting from surface cleaning via coating to etching. In total, the range of the treated substrates covers some orders of magnitude: Trenches and linewidths of commercially available devices have - ready passed the boundary of 100 nm, decorative surface treatment will happen 2 in the mm range, and the upper limit is reached with surface protecting layers of windows which are coated with ?/4 layers against IR radiation. The rapid development of the semiconductor industry is inconceivable wi- outthegiantprogressintheplasmatechnology.Moore’slawisnotcarvedinto 1 stone, and not only the ITRS map is subject to change every ?ve years but also new branches develop and others mingle together. Moreover, the quality of conventional materials can be improved by plasma treatment:Cottonbecomesmorecrease-resistant,leathermoredurable,andthe shrinking of wool ?bers during the washing process can be signi?cantly reduced. To cut a long story short: More than 150 years after the discovery of the sputtering e?ect by Grove, plasma-based processes are about to spread out into new ?elds of research and application [1]—no wonder that the market for etching machines kept growing by an annual rate of 17 % up to the burst of the internet bubble, and it took only some years of recovery to continue the voyage [2]. Full Product DetailsAuthor: Gerhard FranzPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: 2009 ed. Dimensions: Width: 15.50cm , Height: 3.90cm , Length: 23.50cm Weight: 2.710kg ISBN: 9783540858485ISBN 10: 3540858482 Pages: 732 Publication Date: 30 April 2009 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsCollisions and cross sections.- The plasma.- DC discharges.- High-frequency discharges I.- High-frequency discharges II.- High-frequency discharges III.- Ion beam systems.- Plasma diagnostics.- Plasma deposition processes.- Plasma etch processes.- Etch Mechanisms.- Outlook.- Advanced Topics.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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