Overview

Epoxy resins are regarded as thermosetting resins and have found various c- mercial applications after crosslinking with adequate curing agents [1–3]. H- ever, some epoxy resins have been used as thermoplastic resins without curing agents. Figure 1 shows the applications of epoxy resins that are classi?ed to three categories: thermosets in combination with curing agents, thermoplastics wi- out curing agents, and raw materials for modi?cation. The use in thermoplastics is not popular compared with the two other applications. Typical thermoplastic applications are found in stabilizers for vinyl resins, toners for copying - chines, ?re retardants for engineering plastics, and sizing material for glass or carbon ?bers. The epoxy resin most frequently used is the oligomer of the diglycidyl ether of bisphenol-A (DGEBA) whose chemical structure is shown below [1–3]. The DGEBA is composed of linear molecules with different molecular weights according to the variation of the repeated number (n) in the structural formula.

Full Product Details

Author:   A. Budkowski ,  I.W. Hamley ,  T. Koike
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Edition:   Softcover reprint of the original 1st ed. 1999
Volume:   148
Dimensions:   Width: 15.50cm , Height: 1.20cm , Length: 23.50cm
Weight:   0.338kg
ISBN:  

9783662156292

ISBN 10:   3662156296
Pages:   205
Publication Date:   13 November 2013
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

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