Overview

Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.

Full Product Details

Author:   Subhash L. Shinde ,  Jitendra Goela
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2006
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9781441919564

ISBN 10:   1441919562
Pages:   271
Publication Date:   06 October 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Lattice Thermal Conduction Mechanism in Solids.- High Lattice Thermal Conductivity Solids.- Thermal Characterization of the High-Thermal-Conductivity Dielectrics.- Thermal Wave Probing of High-Conductivity Heterogeneous Materials.- Fabrication of High-Thermal-Conductivity Polycrystalline Aluminum Nitride: Thermodynamic and Kinetic Aspects of Oxygen Removal.- High-Thermal-Conductivity SiC and Applications.- Chemical-Vapor-Deposited Diamond for High-Heat-Transfer Applications.- Unusually High Thermal Conductivity in Carbon Nanotubes.

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