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OverviewSince its development in the late 1970s, the Moiré Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moiré Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis is on the application of the method to real situations, and presents a very readable account of the technique from the point of view of the user. As an introduction to the Moiré technique and its variants, this book will be of interest to readers at all levels, but is particularly suitable for undergraduates and graduate students in physics, materials science, and structural and mechanical engineering. Full Product DetailsAuthor: C.A. WalkerPublisher: Taylor & Francis Ltd Imprint: CRC Press Weight: 0.453kg ISBN: 9780367454425ISBN 10: 0367454424 Pages: 501 Publication Date: 26 November 2019 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Paperback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1 Introduction, 1.1 A brief history of the moiré method, References, CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT—THE MOIRÉ MICROSCOPE, 2.1 Nonlinear analysis of interferometric moiré fringes, 2.1.1 Example fringe data reduction, References, 2.2 Microscopic moiré interferometry, 2.2.1 Immersion interferometer, 2.2.1.1 Optical configuration, 2.2.1.2 Four-beam immersion interferometer, 2.2.2 Mechanical configuration, 2.2.3 Fringe shifting and O/DFM method, References, 2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry, 2.3.1 Specimen preparation, 2.3.2 Thin small outline package, 2.3.3 Leadless chip carrier, 2.3.4 Effect of underfill encapsulation on flip chip solder bump, 2.3.5 Plated through hole, References, 2.4 Titanium in elastic tension: micromechanical deformation, 2.4.1 Introduction, 2.4.2 Specimen and loading fixture, 2.4.3 Experimental procedure and fringe patterns, 2.4.4 Anomalous strains along the grain boundaries, 2.4.5 Discussion, References, 2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite, 2.5.1 Experimental procedure and fringe patterns, 2.5.2 Analysis and results, 2.5.3 Discussion, References, CHAPTER 3: FRACTURE MECHANICS, 3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load, 3.1.1.1 Introduction, 3.1.1.2 Experimental details, 3.1.1.3 Measurement of Von Mises yield locus, 3.1.1.4 Discussion of results, 3.1.1.5 Conclusions, References, 3.1.2 Deformation around fatigue cracks from moiré fringe measurement, 3.1.2.1 Introduction, 3.1.2.2 Basic crack-tip models, 3.1.2.2.1 Stationary crack under monotonie loading, 3.1.2.2.2 Stationary crack under cyclic loading, 3.1.2.3 Experimental details, 3.1.2.4 Fatigue crack-tip deformation, 3.1.2.4.1 Local yielding, 3.1.2.4.2 Non-singular stresses, 3.1.2.4.3 Cyclic plasticity, 3.1.2.4.4 Local mode-mixity, 3.1.2.5 Summary, Acknowledgment, References, 3.2.1 Applications of moiré to cellulosic (paper and wooReviewsAuthor InformationCA Walker Department of Mechanical Engineering, University of Strathclyde, UK Tab Content 6Author Website:Countries AvailableAll regions |
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