Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author:   Karl J. Puttlitz (IBM, East Fishkill, New York, USA) ,  Kathleen A. Stalter (IBM, Fishkill, New York, USA) ,  Kathleen A. Stalter (IBM, Fishkill, New York, USA)
Publisher:   Taylor & Francis Inc
Volume:   170
ISBN:  

9780824748708


Pages:   1044
Publication Date:   27 February 2004
Format:   Hardback
Availability:   In Print   Availability explained
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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies


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Overview

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Full Product Details

Author:   Karl J. Puttlitz (IBM, East Fishkill, New York, USA) ,  Kathleen A. Stalter (IBM, Fishkill, New York, USA) ,  Kathleen A. Stalter (IBM, Fishkill, New York, USA)
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Volume:   170
Dimensions:   Width: 17.80cm , Height: 5.40cm , Length: 25.40cm
Weight:   2.100kg
ISBN:  

9780824748708


ISBN 10:   0824748700
Pages:   1044
Publication Date:   27 February 2004
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations.

Reviews

[This book] is a complete primer that provides thorough and comprehensive knowledge to electronic manufacturers engaged in developing, manufacturing and utilizing lead free solder technologies in microelectronic assemblies. The book also addresses other important aspects such as health, environmental impact, legislation, global regulations, and market economics associated with this issue. Numerous illustrations, tables, and graphs are provided in each chapter to help readers grasp important concepts covered. Besides practicing engineers, advanced undergraduate students and graduate students in these disciplines may also find the book useful since it does not assume prior knowledge of the subject discussed and provides necessary background information. - E-Streams, Vol. 7, No. 11, Nov. 2004 The book is laid out in a pleasant fashion with clear figuresEach chapter has an extensive list of references that would be extremely useful to researchers as well as microelectronic equipment manufacturers. The book is a comprehensive review of all aspects related to the development of lead-free solders, and the editors are commended for including global efforts along these linesThe editors succeeded in meeting their goals of making this book useful to folks concerned about electronic solders-scientists, researchers, managers, and marketing personnel, as well as students working toward advanced degreesThis is an excellent sequel [that] should be on the shelf of everyone working on microelectronics solders and packaging. -JOM, August 2005


Author Information

Karl J. Puttlitz, Kathleen A. Stalter

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