Flexible Electronic Packaging and Encapsulation Technology

Author:   Hong Meng (Peking University) ,  Wei Huang (Northwestern Polytechnical University)
Publisher:   Wiley-VCH Verlag GmbH
ISBN:  

9783527353590


Pages:   384
Publication Date:   24 April 2024
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Flexible Electronic Packaging and Encapsulation Technology


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Author:   Hong Meng (Peking University) ,  Wei Huang (Northwestern Polytechnical University)
Publisher:   Wiley-VCH Verlag GmbH
Imprint:   Blackwell Verlag GmbH
Dimensions:   Width: 17.00cm , Height: 2.60cm , Length: 24.40cm
Weight:   0.879kg
ISBN:  

9783527353590


ISBN 10:   3527353593
Pages:   384
Publication Date:   24 April 2024
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Hong Meng, PhD, is Professor in the School of Advanced Materials at Peking University Shenzhen Graduate School, China. He has been working in the field of organic electronics for more than 30 years, including working at the Instute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, and DuPont Experimental Station. Wei Huang, PhD, is Professor at Frontiers Science Center for Flexible Electronics, Institute of Flexible Electronics, Northwestern Polytechnical University, China. He is Academician of Chinese Academy of Sciences, Russian Academy of Sciences, International Member of the National Academy of Engineering of USA, Academy of Engineering and Technology, Asian Pacific Academy of Materials, and Pakistan Academy of Sciences. He is an eminent scientist in the area of organic optoelectronics and flexible electronics.

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