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Author:   Mitsuharu Konuma
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Volume:   v. 10
Weight:   0.470kg
ISBN:  

9783540540571

ISBN 10:   3540540571
Pages:   224
Publication Date:   30 April 1992
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock  
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Table of Contents

1. The Plasma State.- 1.1 Characterization of Plasma.- 1.1.1 The Temperature of the Plasma.- 1.1.2 Plasma Density.- 1.1.3 Plasma Oscillation.- 1.2 Classification of Plasma.- 1.2.1 Cold Plasma.- 1.2.2 Thermal Plasma.- 2. Reactions in Plasmas.- 2.1 Collision Phenomena.- 2.1.1 Velocity Distribution of Particles.- 2.1.2 Elastic and Inelastic Collisions.- 2.1.3 Collision Frequency and Mean-Free Path.- 2.1.4 Reaction Cross Section.- 2.2 Excitation and Ionization.- 2.2.1 Internal Energy.- 2.2.2 Excitation and Ionization Processes.- 2.2.3 Excitation and Ionization by an Electron Collision.- a) Excitation and Ionization of an Atom.- b) Excitation and Ionization of a Molecule.- 2.2.4 Excitation and Ionization by Collisions of Energetic Ions or Neutral Particles.- a) Thermal Ionization.- b) Penning Ionization.- c) Ionization by Collisions Among Excited Particles.- 2.2.5 Photo-Excitation and Photo-Ionization.- 2.3 Recombination.- 2.3.1 Recombination Processes.- 2.3.2 Ion-Electron Recombination.- 2.3.3 Ion-Ion Recombination.- 2.4 Ion-Molecule Reactions and Reactions Involving Negative Ions.- 2.4.1 Attachment and Detachment.- 2.4.2 Ion-Molecule Reaction.- 2.5 Transport Phenomena.- 2.5.1 Drift.- 2.5.2 Diffusion.- 3. Generation of Cold Plasma.- 3.1 Electrical Breakdown and Starting Voltage.- 3.1.1 Static Electric Field.- 3.1.2 Alternating Electric Field.- 3.2 Glow Discharge.- 3.2.1 General Characteristics.- 3.2.2 Potential Distribution.- 3.2.3 Normal Glow and Abnormal Glow.- 3.2.4 Hollow Cathode Discharge.- 3.3 High-Frequency Discharge.- 3.3.1 Generation of High-Frequency Discharge.- 3.3.2 Potential Distribution and Self-Bias.- 3.3.3 Plasma Potential.- 3.4 Microwave Discharge.- 3.4.1 Generation of Microwave Discharge.- 3.4.2 Electron Cyclotron Resonance.- 4. Plasma Diagnostics.- 4.1 Optical Spectroscopy.- 4.1.1 Optical Emission Spectroscopy.- 4.1.2 Optical Absorption Spectroscopy.- 4.1.3 Laser-Induced Fluorescence Spectroscopy.- 4.1.4 Coherent Anti-Stokes Raman Spectroscopy.- 4.1.5 Optogalvanic Spectroscopy.- 4.2 Probes.- 4.2.1 Langmuir Single Probe.- 4.2.2 Double Probe.- 4.2.3 Emissive Probe.- 4.3 Particle Measurements.- 4.3.1 Mass Spectrometry.- 4.3.2 Energy Analysis of Ions.- 4.4 Others.- 4.4.1 Electron-Spin Resonance.- 4.4.2 Microwave Diagnostics.- 5. Cold Plasma and Thin Film Formation.- 5.1 Interactions of Cold Plasma with Solid Surfaces.- 5.1.1 Adsorption and Trapping.- 5.1.2 Sputtering.- 5.1.3 Secondary-Electron Emission.- 5.1.4 Chemical Reactions on Solid Surfaces.- 5.2 Application of Cold Plasma to Thin Film Deposition.- 5.2.1 Classification of Deposition Processes.- 5.2.2 General Considerations of Plasma Processes.- 6. Physical Vapor Deposition Under Plasma Conditions.- 6.1 Sputter Deposition.- 6.1.1 Features of Sputter Deposition.- 6.1.2 Reactor Configuration.- 6.1.3 Reactive Sputter Deposition.- 6.1.4 Morphology and Characteristics of the Films.- 6.2 Ion Plating.- 6.2.1 Reactor Types and Features.- 6.2.2 Applications of Ion Plating.- 7. Chemical Vapor Deposition Under Plasma Conditions.- 7.1 Plasma-Enhanced Chemical Vapor Deposition.- 7.1.1 Reaction Mechanisms.- 7.1.2 System Design.- 7.1.3 Applications of Plasma Enhanced CVD.- a) Amorphous Silicon.- b) Silicon Nitride.- c) Amorphous and Diamond-Like Carbon.- d) Other Materials.- 7.2 Plasma Polymerization.- 7.2.1 Features of Plasma Polymerization.- 7.2.2 System Design.- 7.2.3 Plasma Polymer.- 7.3 Other Techniques.- 7.3.1 Plasma Stream Transport.- 7.3.2 Chemical Transport in Plasmas.- 7.3.3 Film Deposition Using Electron Cyclotron Resonance Plasma Sources.- 8. Surface Modification by Cold Plasma.- 8.1 Surface Treatment for Metals and Semiconductors.- 8.1.1 Ion Nitriding and Ion Carburizing.- 8.1.2 Plasma Nitriding.- 8.1.3 Plasma Oxidation and Plasma Anodization.- 8.1.4 Hydrogen Neutralization in Semiconductors.- 8.1.5 Other Techniques for Metal Surface Treatment.- 8.2 Modification of Polymer Surfaces.- References.- Further Reading.

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