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OverviewFull Product DetailsAuthor: Seiji SamukawaPublisher: Springer Verlag, Japan Imprint: Springer Verlag, Japan Edition: 2014 ed. Dimensions: Width: 15.50cm , Height: 0.30cm , Length: 23.50cm Weight: 0.949kg ISBN: 9784431547945ISBN 10: 4431547940 Pages: 40 Publication Date: 17 February 2014 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsIntroduction.- On-wafer UV sensor and prediction of UV irradiation damage.- Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System.- Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.ReviewsAuthor InformationProf. Seiji Samukawa Distinguished Professor in Tohoku University Professor in Institute of Fluid Science, Professor and Principal Investigator, WPI-AIMR in Tohoku University. Tab Content 6Author Website:Countries AvailableAll regions |
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