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Overview"Electrostatic Discharge (ESD) is a pervasive issue in the semiconductor industry affecting both manufacturers and users of semiconductors. The problem worsens with each new generation of parts and components. As technology scales to higher levels of integration, circuits become more sensitive to ESD and the design of protection becomes more difficult. This text presents an overview of ESD as it effects electronic circuits and provides a concise introduction for students, engineers, circuit designers and failure analysts. This handbook is written in simple terms and is filled with practical advice and examples to illustrate the concepts presented. While this treatment is not exhaustive, it presents many of the most important areas of the ESD problem and suggests methods for improving them. The key topics covered include the physics of the event, failure analysis, protection, characterization, and simulation techniques. The book is intended as both an introductory text on ESD and a useful reference tool to draw on as the reader gains experience. The authors have tried to balance the level of detail in the ""ESD Design and Analysis Handbook"" against the wealth of literature published on ESD every year. To that end, each chapter has a topical list of references to facilitate further in-depth study." Full Product DetailsAuthor: James E. Vinson , Joseph C. Bernier , Gregg D. Croft , Juin Jei LiouPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2003 ed. Dimensions: Width: 15.50cm , Height: 1.80cm , Length: 23.50cm Weight: 0.504kg ISBN: 9781402073502ISBN 10: 140207350 Pages: 207 Publication Date: 31 December 2002 Audience: College/higher education , Professional and scholarly , General/trade , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsForeword. 1: Physics and Models of an ESD Event. 1.1. ESD in our World. 1.2. ESD in Semiconductors. 1.3. The ESD Event. 1.4. Degradation and Latency. 1.5. Topical Reference List. 2: Failure Analysis Techniques. 2.1. Overview of Failure Analysis. 2.2. Failure Analysis Objectives. 2.3. Failure Site Identification. 2.4. Root Cause and Corrective Action. 2.5. Topical Reference List. 3: Environmental Protection. 3.1. Environmental Philosophy. 3.2. Room Level Controls. 3.3. Work Area Controls. 3.4. Personal Controls. 3.5. Packaging and Storage. 3.6. Handling Equipment. 3.7. Auditing. 3.8. Topical Reference List. 4 : Chip Level Protection. 4.1. Protection Approach. 4.2. Off Chip Protection. 4.3. On-Chip Protection. 4.4. Topical Reference List. 5: Device Characterization. 5.1. Circuit Element Sensitivity. 5.2. TLP Testing. 5.3. Characterization Matrix. 5.4. Topical Reference List. 6: ESD Modeling. 6.1. Circuit Modeling. 6.2. Device Modeling. 6.3. Topical Reference List. IndexReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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