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OverviewElectronic Components Failure Analysis for Beginners: Methods and Experience A Practical Guide to Instrument-Based Failure Diagnosis for Beginners This book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis. The colorful graphic analysis report allows you to absorb the author's years of experience. Beginners can learn a lifetime's worth of analysis tools in one go and quickly accumulate a year's worth of expertise. Content includes: BGA analysis DYE and PRY test 2D/3D X-ray analysis Silver migration analysis EDX energy dispersive spectroscopy reports Sulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysis Soldering ability test FTIR Fourier transform infrared spectrometer reports XRF fluorescent X-ray hazardous substance analyzer reports LED popcorn stress failure Electrostatic damage C-SAM ultrasonic inspection And various component failure analysis reports. Full Product DetailsAuthor: Tsai Feng SungPublisher: Sung Tsai Feng Isbn: 978-626-01-5418-9 Imprint: Sung Tsai Feng Isbn: 978-626-01-5418-9 Dimensions: Width: 21.00cm , Height: 0.60cm , Length: 29.70cm Weight: 0.318kg ISBN: 9786260154189ISBN 10: 6260154186 Pages: 92 Publication Date: 12 December 2025 Audience: General/trade , General Format: Paperback Publisher's Status: Active Availability: Available To Order We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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