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OverviewBonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience. Full Product DetailsAuthor: Jan A. DziubanPublisher: Springer Imprint: Springer Edition: Softcover reprint of hardcover 1st ed. 2006 Volume: 24 Dimensions: Width: 15.50cm , Height: 1.80cm , Length: 23.50cm Weight: 0.539kg ISBN: 9789048171514ISBN 10: 9048171512 Pages: 334 Publication Date: 25 November 2010 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Out of print, replaced by POD  We will order this item for you from a manufatured on demand supplier. Table of ContentsSome Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.Reviews"From the reviews: ""Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. … Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students."" (Current Engineering Practice, 2007)" From the reviews: Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ! Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. (Current Engineering Practice, 2007) From the reviews: Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. (Current Engineering Practice, 2007) Author InformationTab Content 6Author Website:Countries AvailableAll regions |
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