Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Author:   Ephraim Suhir (Portland State University, Portland, USA)
Publisher:   Taylor & Francis Ltd
ISBN:  

9780367635886


Pages:   382
Publication Date:   04 October 2024
Format:   Paperback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices


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Author:   Ephraim Suhir (Portland State University, Portland, USA)
Publisher:   Taylor & Francis Ltd
Imprint:   CRC Press
Weight:   0.453kg
ISBN:  

9780367635886


ISBN 10:   0367635887
Pages:   382
Publication Date:   04 October 2024
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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