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Author:   Yosi Shacham-Diamand ,  Tetsuya Osaka ,  Madhav Datta ,  Takayuki Ohba
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2009 ed.
Dimensions:   Width: 15.50cm , Height: 3.40cm , Length: 23.50cm
Weight:   1.120kg
ISBN:  

9780387958675

ISBN 10:   0387958673
Pages:   552
Publication Date:   27 October 2009
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Challenges in ULSI Interconnects - Introduction to the Book.- Technology Background.- MOS Device and Interconnects Scaling Physics.- Interconnects in ULSI Systems: Cu Interconnects Electrical Performance.- Electrodeposition.- Electrophoretic Deposition.- Wafer-Level 3D Integration for ULSI Interconnects.- Interconnect Materials.- Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization.- Silicides.- Materials for ULSI metallization - Overview of Electrical Properties.- Low-? Materials and Development Trends.- Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects.- ALD Seed Layers for Plating and Electroless Plating.- Deposition Processes for ULSI Interconnects.- Electrochemical Processes for ULSI Interconnects.- Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing.- Electroless Deposition Approaching the Molecular Scale.- Modeling.- Modeling Superconformal Electrodeposition Using an Open Source PDE Solver.- Electrochemical Process Integration.- to Electrochemical Process Integration for Cu Interconnects.- Damascene Concept and Process Steps.- Advanced BEOL Technology Overview.- Lithography for Cu Damascene Fabrication.- Physical Vapor Deposition Barriers for Cu metallization - PVD Barriers.- Low-k Dielectrics.- CMP for Cu Processing.- Electrochemical View of Copper Chemical-Mechanical Polishing (CMP).- Copper Post-CMP Cleaning.- Electrochemical Processes and Tools.- Electrochemical Processing Tools for Advanced Copper Interconnects: An Introduction.- Electrochemical Deposition Processes and Tools.- Electroless Deposition Processes and Tools.- Tools for Monitoring and Control of Bath Components.- Processes and Tools for Co Alloy Capping.- Advanced Planarization Techniques.- Metrology.- Integrated Metrology (IM) History at aGlance.- Thin Film Metrology - X-ray Methods.- Summary and Foresight.- Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice.- Self-Assembly of Short Aromatic Peptides: From Amyloid Fibril Formation to Nanotechnology.

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