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Full Product Details

Author:   Xingcun Colin Tong, Ph.D. (Laird Technologies, Schaumburg, Illinois, USA)
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Dimensions:   Width: 15.60cm , Height: 2.30cm , Length: 23.40cm
Weight:   0.612kg
ISBN:  

9781420073584

ISBN 10:   1420073583
Pages:   340
Publication Date:   19 November 2008
Audience:   Professional and scholarly ,  Professional & Vocational ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Electromagnetic Interference Shielding Fundamentals and Design Guide. Characterization Methodology of EMI Shielding Materials. EMI Shielding Enclosure and Access. Metal-Formed EMI Gaskets and Connectors. Conductive Elastomer and Flexible Graphite Gaskets. Conductive Foam and Ventilation Structure. Board-Level Shielding Materials and Components. Composite Materials and Hybrid Structures for EMI Shielding. Absorber Materials. Grounding and Cable-Level Shielding Materials. Special Shielding Materials in Aerospace and Nuclear Industries. Perspectives and Future Trends. Index.

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Laird Technologies, Schaumburg, Illinois, USA

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