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Author:   Chuan Seng Tan (Nanyang Technological University, Singapore) ,  Kuan-Neng Chen (National Chiao Tung University, Hsinchu, Taiwan) ,  Steven J. Koester (IBM Research Division, Yorktown Heights, New York, USA)
Publisher:   Pan Stanford Publishing Pte Ltd
Imprint:   Pan Stanford Publishing Pte Ltd
Weight:   0.636kg
ISBN:  

9789814303811

ISBN 10:   981430381
Pages:   378
Publication Date:   26 September 2011
Audience:   College/higher education ,  Professional and scholarly ,  Tertiary & Higher Education ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Awaiting stock  
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<p> 3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology. <br> Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA

Author Information

Chuan Seng Tan, Kuan-Neng Chen

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