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OverviewThis book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding. Full Product DetailsAuthor: Lucas F. M. da Silva , Robert D. Adams , Chiaki Sato , Klaus DilgerPublisher: Springer Verlag, Singapore Imprint: Springer Verlag, Singapore Edition: 1st ed. 2021 Weight: 0.454kg ISBN: 9789811567667ISBN 10: 9811567662 Pages: 138 Publication Date: 23 July 2020 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsNovel torsion machine to test adhesive joints.- Ageing condition determination of bonded joints by terahertz spectroscopy.- Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates.- Some Industrial Examples of Accelerated Curing Using Curie Particles.- Use of UV-curing adhesive systems on non-transparent joining parts by using sidelight activated polymer optical fibres.- Techniques for the mechanical characterization and numerical modelling of bonded automotive structures under impact loads.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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