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OverviewSynthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design. Full Product DetailsAuthor: Tadahiro Kuroda (University of Tokyo) , Wai-Yeung Yip (University of Tokyo)Publisher: Cambridge University Press Imprint: Cambridge University Press Dimensions: Width: 17.70cm , Height: 2.40cm , Length: 25.10cm Weight: 0.752kg ISBN: 9781108841214ISBN 10: 110884121 Pages: 300 Publication Date: 30 September 2021 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of Contents1. Introduction – 3D integration and near-field coupling; 2. ThruChip interface – a wireless chip interface; 3. Transmission line coupler – a wireless module connector; 4. The future of computing – 3D SRAM for neural network, eBrain.ReviewsAuthor InformationTadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE. Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design. Tab Content 6Author Website:Countries AvailableAll regions |
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